Cut the memory in half and keep the module working. That is what Fibocom says it has done with the FG550-EAU, a 5G module built on Samsung’s Exynos Modem platform. The company showed it at MWC Shanghai 2026, according to its June 23 announcement.
The earlier configuration used 8Gb of LPDDR4x RAM. The new one uses 4Gb. Fibocom says the module still has its business functions and the room for customer-specific customization.
Why memory matters here
Demand from AI servers and data centers has made memory scarce and its price jumpy. Fibocom says that makes memory cost and availability a deciding factor in whether 5G devices reach mass production. A smaller RAM chip, the company argues, lowers the bill of materials for customers and makes deliveries more predictable.
How it was done
Fibocom says it worked from the actual operating requirements of terminals. Engineers reviewed the low-level code, reworked memory scheduling and allocated system resources more precisely, which let the module run stably on 4Gb. The company says the module keeps its key features and gains in resource use, operating experience and power efficiency.
The FG550-EAU supports 3GPP Rel.16 and NR 5CC carrier aggregation. It works with LTE Cat.20 and handles 4G and 5G dual-mode connections on mainstream networks worldwide.
Xuebao Pan, senior vice president and head of the System LSI R&D Center at Samsung Semiconductor China Research, called it a breakthrough in balancing performance and cost. “Samsung Exynos Modem and Fibocom share a strong and enduring partnership,” he said.
Fibocom describes itself as China’s first wireless communication module company listed on both the A-share and H-share markets. It says it will keep working with global FWA, mobile broadband and IoT customers on 5G products.
Sources
- Fibocom Achieves 4Gb LPDDR4x Memory Optimization on FG550, Strengthening Cost and Supply Competitiveness for 5G Devices
- Fibocom Achieves 4Gb LPDDR4x Memory Optimization on FG550, Strengthening Cost and Supply Competitiveness for 5G Devices
