Xiaomi’s lab recorded 5,228,014 points on AnTuTu v11 for a chip no customer can buy yet. That number, the first past five million for a mobile processor, anchored a Monday event in Beijing on August 24, where the company unveiled three of its own Xring chips at once and added a prototype mini PC that runs all of them.
China Daily reported that the O3 smartphone chip, the O100 AI accelerator and the D100 driving chip have all completed tape-out verification. Xiaomi described the Xring brand as having grown from a single phone chip into a base for AI computing across “human, car, and home” products.
Xring O3: ten big cores, no small ones
Most Android chips mix fast cores with small efficiency cores that handle idle work. The O3 drops the small ones. Its ten-core CPU is built from two C1-Ultra cores running at up to 4.35GHz, four C1-Premium cores at 3.68GHz and four C1-Pro cores at 3.15GHz. Tech Times noted that the approach favours sustained performance and could cost battery life under light loads, and that only retail hardware testing will show how it plays out.
The chip uses a 3nm process, is made on TSMC’s N3P node and holds 24 billion transistors, up 26 percent from its predecessor, according to China Daily. Xiaomi reported a Geekbench 6.5 multi-core result of 15221. It is also billed as the first mobile processor to support LPDDR6 memory, and it carries a 16-core G2-Ultra NX graphics unit and an NPU rated at 200 TOPS.
Two products will carry it first, both launching in China in September 2026: the Xiaomi 18 Fold foldable phone and the Xiaomi Pad 9 Pro Max tablet. Reuters, citing people familiar with the plans, put shipment targets for the foldable at 200,000 to 300,000 units. Huawei is the incumbent there. One research firm gave it about 68% of China’s foldable market in the second quarter of 2026, with 1.6 million units shipped.
O100 and D100: next year
The O100 is a 6nm accelerator built with 3D wafer-level stacking. Xiaomi says it can reach up to 1.22 TB/s of near-memory computing bandwidth, and it is aimed at running AI models on the device instead of in the cloud. The D100 is the car chip. It is a 3nm part with a 20-core CPU and a 16-core NPU, supports up to 160GB of unified memory and can run models of up to 200 billion parameters locally, Xiaomi said. China Daily called it China’s first 3nm intelligent driving chip.
Neither ships this year. Both are scheduled for commercial deployment in 2027.
The AI Cube
The prototype that ties it together is the AI Cube, a mini PC built around the O3, O100 and D100. Notebookcheck reported that Xiaomi claims up to 150 W of sustained performance, and that the machine can deploy 120B and 3B models and switch between fast and slow systems. Rivals such as Nvidia’s DGX Spark and Asus’ Ascent GX10 also offer 128 GB of unified memory and local models of up to 200 billion parameters, but those use a different design. Xiaomi’s uses three separate chips of its own.
The case itself is a single aluminum block with 33,874 CNC perforations. There is no price and no release date. Xiaomi has not announced either.
The benchmark caveat is Xiaomi’s to carry. The five-million score came from the company’s own lab under unspecified conditions, and Tech Times said independent results from a production foldable will tell a fuller story.
Sources
- Xiaomi Xring O3 Tops 5M AnTuTu With All-Big-Core CPU and First LPDDR6 Mobile Chip (Tech Times, Elijah Armfield)
- Xiaomi Xring O3 Tops 5M AnTuTu With All-Big-Core CPU and First LPDDR6 Mobile Chip (Tech Times, second passage)
- Xiaomi unveils AI Cube mini PC with three Xring chips and 150 W performance (Notebookcheck, Shahadat Ali)
- Xiaomi launches three self-developed chips (China Daily, Ma Si)
