TOKYO, October 26, 2026 — Japanese chipmaker Rapidus and India’s HCLTech officially opened two development hubs in Bengaluru and Hubli to scale engineering capabilities for next-generation semiconductors. The centers will support Rapidus with mask design, design infrastructure, and process design kit development, while HCLTech collaborates to build a pipeline of Indian engineering talent for deployment in Japan.
India Hubs Open to Serve Rapidus Engineering Needs
The new facilities mark the first dedicated semiconductor engineering outposts for Rapidus outside Japan. Located in Bengaluru and Hubli, the centers will deliver capabilities ranging from mask design to process design kit development. According to the joint statement, HCLTech will work with Rapidus to train and place Indian engineers in roles supporting the Japanese firm’s manufacturing roadmap.
Talent Pipeline Aims to Fill Japan Roles
HCLTech, which employs more than 230,000 people across 60-plus countries, will coordinate training programs to prepare engineers for assignments in Japan. The initiative addresses a key constraint for Rapidus as it scales production: securing skilled engineering labor. Officials said the partnership seeks to bridge the gap between India’s technical education output and the specific requirements of advanced logic semiconductor fabrication.
Leadership Emphasize Japan-India Tech Ties
Dr. Atsuyoshi Koike, Representative Director and CEO of Rapidus Corporation, stated that building a strong engineering ecosystem is essential to the company’s mission of establishing next-generation semiconductor manufacturing in Japan. C Vijayakumar, CEO and Managing Director of HCLTech, called the collaboration a reflection of growing strategic ties between the two nations, noting it will accelerate chip adoption and compress time-to-market for advanced technologies.
Revenues and Scale
HCLTech reported consolidated revenues of $14.8 billion for the 12 months ending September 2026. Rapidus, for its part, continues to develop and manufacture advanced logic semiconductors with a focus on reducing development and production timelines. The companies have not disclosed the financial terms of the partnership or the exact number of engineers slated for the Indian centers.
Expanded Engineering Capabilities Beyond Mask Design
The newly established centers will leverage HCLTech’s global leadership to deliver a comprehensive suite of semiconductor engineering services. Beyond mask design, the facilities will provide design infrastructure and process design kit development. Additionally, the scope includes design technology co-optimization and layout design, addressing specific requirements for next-generation logic semiconductors. These capabilities are intended to complement Rapidus’ existing operations in Japan while shortening cycle times across design, wafer processes, and 3D packaging.
HCLTech will utilize its broad portfolio of technology services and products to support these specialized engineering needs. The company works with clients across major verticals, including Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Semiconductor, Telecom and Media, Retail and CPG, Mobility and Public Services. This diverse experience informs the development capabilities established at the Bengaluru and Hubli sites.
The partnership aims to shorten cycle times in design, wafer processes, and 3D packaging through these dedicated services. By combining Rapidus’ ambitions with HCLTech’s expertise, the collaboration seeks to accelerate chip adoption and compress time-to-market for advanced technologies. This approach allows Rapidus to access India’s growing pool of talent while establishing resources needed to support its long-term objectives in developing advanced logic semiconductors.
Engineering Curriculum Aligned With Rapidus Requirements
HCLTech will design and deliver specialized training modules tailored to the technical demands of Rapidus’ advanced logic semiconductor fabrication. According to the partnership announcement, the curriculum will focus on mask design, process design kit development, and design technology co-optimization, ensuring engineers are proficient in the specific workflows required for next-generation production. The initiative draws on HCLTech’s experience deploying over 230,000 professionals across 60-plus countries to address the skill gap identified by Rapidus as a primary barrier to scaling Japan-based manufacturing.
Training sessions will be conducted at the Bengaluru and Hubli centers, with a focus on practical application of layout design and 3D packaging techniques. Officials stated the program aims to compress the time required to onboard qualified engineers, allowing Rapidus to accelerate its development roadmap. By aligning education output with fabrication needs, the partnership seeks to ensure a steady flow of ready-to-deploy talent supporting Rapidus’ long-term objectives in advanced chip production.
Sources
- Rapidus and HCLTech announce partnership for next-generation semiconductor technologies – AOL
- Rapidus and HCLTech announce partnership for next-generation semiconductor technologies
- HCLTech: HCLTech, Japan's Rapidus announce partnership for next generation semiconductor technologies – The Economic Times
Photo: Wikimedia Commons (Public domain)
