BEIJING, Sept. 3 — Xiaomi has taken a decisive step beyond the smartphone with a sweeping expansion of its in-house chip efforts, unveiling three new silicon platforms and an AI computing prototype that together span phones, vehicles, and edge processing. The announcement, made on September 1 and detailed by Counterpoint Research, marks a strategic shift from Xiaomi’s smartphone-focused semiconductor work to a multi-domain AI chip ecosystem.
The new lineup includes the XRING O3 smartphone system-on-chip, the XRING O100 AI accelerator, and the XRING D100 automotive SoC, alongside a prototype device called the AI Cube.
A 3nm phone chip with a memory first
The XRING O3 is built on TSMC’s 3nm node and uses a 10-core all-big-core CPU architecture, pairing two C1-Ultra cores with four C1-Premium and four C1-Pro cores. Graphics come from a 16-core G2-Ultra NX GPU, which Xiaomi says delivers major performance gains over competing designs. It is also the first smartphone SoC to support LPDDR6 DRAM, with memory speeds reaching 10667 Mbps and bandwidth of 113.8 GB/s.
The chip is expected to power the Xiaomi 18-Fold smartphone, likely launching in September 2026, and the Xiaomi Pad 9 Pro Max tablet, expected in the fourth quarter of 2026.
Stacked silicon for AI and autos
The XRING O100 is Xiaomi’s first AI accelerator chip. It uses a 6nm base process with 3D wafer-level stacking, vertically combining a 6nm NPU compute wafer with dual high-speed DRAM memory wafers using wafer-to-wafer hybrid bonding at a 1.4 μm pitch. That packaging gives the chip HBM-class bandwidth on a mature node.
The O100 carries a 14-core NPU with 1.22 TB/s memory bandwidth and can reach up to 330 tokens per second on a 3B parameter model at the edge. Xiaomi positions it for on-device AI in smartphones, PCs, robots, electric vehicles, and the AI Cube.
The XRING D100, meanwhile, is an automotive SoC on a 3nm process with a 20-core CPU and 16-core NPU. It supports up to 160GB of unified memory and can deploy a 200B parameter model on board. The AI Cube prototype combines all three chips — the O3, O100, and D100 — in a mini-PC form factor with a 150W power envelope.
Xiaomi’s in-house silicon history goes back to the Surge S1 in 2017, though that effort did not grow into a sustained chipset business. The XRING O1 in 2025 marked its return to smartphone silicon.
Just over a year later, the company is now building a cohesive chip ecosystem across its human-car-home product lines — a move that could reshape how its devices talk to one another, and how much of their AI runs on-device rather than in the cloud. Watch for the Xiaomi 18-Fold launch this month as the first real-world test of the O3, and for how quickly the O100 finds its way into vehicles and robots across the region.
